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L5964 Fiches technique(PDF) 13 Page - STMicroelectronics |
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L5964 Fiches technique(HTML) 13 Page - STMicroelectronics |
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13 / 16 page ![]() DB4679 Rev 1 13/16 L5964 Package information 15 VARIATIONS Pad option 6.0x6.0 (T1-T3)(3) D2 - - 6.61 E2 - - 6.61 D3 4.8 - - E3 4.8 - - 1. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash or protrusion is “0.25 mm” per side. 2. The Top package body size may be smaller than the bottom package size by much as 0.15 mm. 3. Number, dimensions and position of shown groves are for reference only: Table 3. LQFP64 (10x10x1.4 mm exp. pad up) package mechanical data (continued) Symbol Dimensions in mm Min. Typ. Max. GADG2108170827PS |
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