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OPA310 Fiches technique(PDF) 52 Page - Texas Instruments |
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OPA310 Fiches technique(HTML) 52 Page - Texas Instruments |
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52 / 55 page ![]() www.ti.com PACKAGE OUTLINE C 16X 0.30 0.18 1.68 0.07 16X 0.5 0.3 0.8 MAX (DIM A) TYP 0.05 0.00 12X 0.5 4X 1.5 A 3.1 2.9 B 3.1 2.9 WQFN - 0.8 mm max height RTE0016C PLASTIC QUAD FLATPACK - NO LEAD 4219117/B 04/2022 SIDE WALL METAL THICKNESS DIM A OPTION 1 OPTION 2 0.1 0.2 PIN 1 INDEX AREA 0.08 SEATING PLANE 1 4 9 12 5 8 16 13 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD 17 SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 3.600 |
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