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TSV771 Fiches technique(PDF) 25 Page - STMicroelectronics |
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TSV771 Fiches technique(HTML) 25 Page - STMicroelectronics |
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25 / 32 page ![]() 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 7.1 SOT23-5 package information Figure 50. SOT23-5 package outline Table 8. SOT23-5 mechanical data Dimensions Symbol Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.90 1.20 1.45 0.035 0.047 0.057 A1 0.15 0.006 A2 0.90 1.05 1.30 0.035 0.041 0.051 B 0.35 0.40 0.50 0.014 0.016 0.020 C 0.09 0.15 0.20 0.004 0.006 0.008 D 2.80 2.90 3.00 0.110 0.114 0.118 D1 1.90 0.075 e 0.95 0.037 E 2.60 2.80 3.00 0.102 0.110 0.118 F 1.50 1.60 1.75 0.059 0.063 0.069 L 0.10 0.35 0.60 0.004 0.014 0.024 K 0° 10° 0° 10° TSV771, TSV772 Package information DS13842 - Rev 3 page 25/32 |
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