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A2P75S12M3-F Fiches technique(PDF) 1 Page - STMicroelectronics

No de pièce A2P75S12M3-F
Description  ACEPACKTM 2 sixpack topology, 1200 V, 75 A trench gate field-stop IGBT M series, soft diode and NTC
PDF  14 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

A2P75S12M3-F Fiches technique(HTML) 1 Page - STMicroelectronics

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ACEPACK™ 2
Features
•
ACEPACK™ 2 power module
–
DBC Cu Al2O3 Cu
•
Sixpack topology
–
1200 V, 75 A IGBTs and diodes
–
Soft and fast recovery diode
•
Integrated NTC
Applications
•
Inverters
•
Industrial
•
Motor drives
Description
This power module is a sixpack topology in an ACEPACK™ 2 package with NTC,
integrating the advanced trench gate field-stop technologies from
STMicroelectronics. This new IGBT technology represents the best compromise
between conduction and switching loss, to maximize the efficiency of any converter
system up to 20 kHz.
Product status
A2P75S12M3-F
Product summary
Order code
A2P75S12M3-F
Marking
A2P75S12M3-F
Package
ACEPACK™ 2
Leads type
Press fit contact pins
ACEPACK™ 2 sixpack topology, 1200 V, 75 A trench gate field-stop IGBT
M series, soft diode and NTC
A2P75S12M3-F
Datasheet
DS11656 - Rev 5 - January 2019
For further information contact your local STMicroelectronics sales office.
www.st.com


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