LM4901MM datasheet(21/24 Pages) NSC

21 / 24 page

Application Information (Continued)

Mono LM4901 Reference Design Boards

Bill of Material

Part Description

Quantity

Reference Designator

LM4901 Audio AMP

Tantalum Capcitor, 1µF

C1, C3

Ceramic Capacitor, 0.39µF

Resistor, 20k

Ω, 1/10W

R2, R3

Resistor, 100k

Ω, 1/10W

R1, R4

Jumper Header Vertical Mount 2X1 0.100“ spacing

J1, J2

PCB LAYOUT GUIDELINES

This section provides practical guidelines for mixed signal

PCB layout that involves various digital/analog power and

ground traces. Designers should note that these are only

"rule-of-thumb" recommendations and the actual results will

depend heavily on the final layout.

GENERAL MIXED SIGNAL LAYOUT

RECOMMENDATION

Power and Ground Circuits

For 2 layer mixed signal design, it is important to isolate the

digital power and ground trace paths from the analog power

and ground trace paths. Star trace routing techniques (bring-

ing individual traces back to a central point rather than daisy

chaining traces together in a serial manner) can have a

major impact on low level signal performance. Star trace

routing refers to using individual traces to feed power and

ground to each circuit or even device. This technique will

require a greater amount of design time but will not increase

the final price of the board. The only extra parts required will

be some jumpers.

Single-Point Power / Ground Connections

The analog power traces should be connected to the digital

traces through a single point (link). A "Pi-filter" can be helpful

in minimizing High Frequency noise coupling between the

analog and digital sections. It is further recommended to put

digital and analog power traces over the corresponding digi-

tal and analog ground traces to minimize noise coupling.

Placement of Digital and Analog Components

All digital components and high-speed digital signal traces

should be located as far away as possible from analog

components and circuit traces.

Avoiding Typical Design / Layout Problems

Avoid ground loops or running digital and analog traces

parallel to each other (side-by-side) on the same PCB layer.

When traces must cross over each other do it at 90 degrees.

Running digital and analog traces at 90 degrees to each

other from the top to the bottom side as much as possible will

minimize capacitive noise coupling and cross talk.

LM4901MM Fiches technique(PDF) 21 Page - National Semiconductor (TI)

LM4901MM Fiches technique(HTML) 21 Page - National Semiconductor (TI)

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

Fiches technique Télécharger

Lien URL