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CC1070-RTY1 Fiches technique(PDF) 54 Page - Texas Instruments |
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CC1070-RTY1 Fiches technique(HTML) 54 Page - Texas Instruments |
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54 / 57 page ![]() CC1070 SWRS043 Page 54 of 58 25.2 Recommended PCB footprint for package (QFN 20) Note: The figure is an illustration only and not to scale. There are 8 14 mil (0.36 mm) diameter via holes distributed symmetrically in the ground plane under the package. See also the CC1070EM reference design. 25.3 Package Thermal Properties Thermal resistance Air velocity [m/s] 0 Rth,j-a [K/W] 30 - 35 25.4 Soldering Information Recommended soldering profile for both standard leaded packages and Pb-free packages is according to IPC/JEDEC J-STD-020C. |
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