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25CSM04 Fiches technique(PDF) 50 Page - Microchip Technology |
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25CSM04 Fiches technique(HTML) 50 Page - Microchip Technology |
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50 / 55 page ![]() 25CSM04 DS20005817D-page 50 2019-2022 Microchip Technology Inc. and its subsidiares RECOMMENDED LAND PATTERN Dimension Limits Units C2 Contact Pitch Contact Pad Spacing Contact Pitch Contact Pitch E3 E2 MILLIMETERS 0.50 BSC MIN E1 MAX Contact Pad Diameter (X8) X1 0.17 NOM E4 Contact Pitch BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M 1. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Microchip Technology Drawing C04-23241 Rev B C1 C2 E1 E1 E2 E3 E2 E4 ØX SILK SCREEN C1 Contact Pad Spacing 0.20 BSC 1.00 BSC 1.10 BSC 2.10 BSC 1.40 BSC 8-Ball Wafer Level Chip Scale Package (CS) - [WLCSP] |
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