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MIC811 Fiches technique(PDF) 5 Page - Microchip Technology |
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MIC811 Fiches technique(HTML) 5 Page - Microchip Technology |
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5 / 16 page ![]() 2022 Microchip Technology Inc. and its subsidiaries DS20006526A-page 5 MIC811/MIC812 TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Operating Temperature Range TA –40 — +85 °C — Storage Temperature Range TS +5 — +150 °C — Lead Temperature — — — +300 °C Soldering, 10 sec. Package Thermal Resistance Thermal Resistance, SOT-143, 4-Ld θJA — 265 — °C/W — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +85°C rating. Sustained junction temperatures above +85°C can impact the device reliability. |
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