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ADL6010ACPZN-R2 Fiches technique(PDF) 22 Page - Analog Devices |
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ADL6010ACPZN-R2 Fiches technique(HTML) 22 Page - Analog Devices |
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22 / 23 page ![]() ADL6010 Data Sheet Rev. E | Page 22 of 23 OUTLINE DIMENSIONS 1.70 1.60 1.50 0.425 0.350 0.275 TOP VIEW SIDE VIEW 6 1 4 3 0.35 0.30 0.25 BOTTOM VIEW 0.60 0.55 0.50 1.10 1.00 0.90 0.20 REF 0.05 MAX 2.10 2.00 SQ 1.90 0.65 BSC EXPOSED PAD FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. SEATING PLANE P IN 1 IN D IC AT O R AR E A OP T IO N S (SEE DETAIL A) PIN 1 INDICATOR AREA COPLANARIT Y 0.08 0.15 MIN DETAIL A (JEDEC 95) Figure 50. 6-Lead Lead Frame Chip Scale Package [LFCSP] 2.00 mm × 2.00 mm Body and 0.55 mm Package Height (CP-6-7) Dimensions shown in millimeters 1.230 0.630 0.155 0.196 0.124 0.185 0.061 0.305 SIDE VIEW 0.185 0.122 0.066 × 0.137 (Pads 1, 4, 6) 0.066 × 0.157 TOP VIEW (CIRCUIT SIDE) 0.846 0.620 0.107 0.089 0.086 0.066 × 0.066 0.069 × 0.066 Figure 51. 6-Pad Bare Die [CHIP] (C-6-14) Dimensions shown in millimeters |
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