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VRF2933 Fiches technique(PDF) 7 Page - Microchip Technology |
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VRF2933 Fiches technique(HTML) 7 Page - Microchip Technology |
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7 / 14 page ![]() 3. Package Specification This section shows the package specification of the VRF2933(MP) device. 3.1 Package Outline Drawing The following figure illustrates the package outline of the VRF2933(MP) device. Figure 3-1. M177 Package Outline Note: Hazardous Material Warning! The ceramic portion of the device between leads and mounting flange is beryllium oxide. Beryllium oxide dust is highly toxic when inhaled. Care must be take during handling and mounting to avoid damage to this area. These devices must never be thrown away with general industrial or domestic waste. The following table shows the package dimensions for the VRF2933(MP) device. Table 3-1. Package Dimensions Dimension Min. Typ. Max. A 0.225 0.230 0.235 VRF2933, VRF2933MP Package Specification © 2022 Microchip Technology Inc. and its subsidiaries Datasheet DS00004434A-page 7 |
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