MIC5209 datasheet(21/30 Pages) MICROCHIP

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2017 - 2022 Microchip Technology Inc. and its subsidiaries

DS20005720B-page 21

MIC5209

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

0.65 BSC

0.203 REF

1.50

0.35

0.20

0.80

0.00

0.25

0.40

1.55

0.85

0.02

3.00 BSC

MILLIMETERS

MIN

NOM

1.60

0.45

0.30

0.90

0.05

MAX

K-

0.20

Terminal-to-Exposed-Pad

Overall Length

Exposed Pad Length

2.25

3.00 BSC

2.30

2.35

Microchip Technology Drawing C04-1021 A Sheet 1 of 2

8-Lead Very Thin Plastic Dual Flat, No Lead Package (JMA) - 3x3x0.9 mm Body [VDFN]

Micrel Legacy Package DFN33-8LD-PL-1

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