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MIC2810 Fiches technique(PDF) 7 Page - Microchip Technology |
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MIC2810 Fiches technique(HTML) 7 Page - Microchip Technology |
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7 / 26 page ![]() 2017 - 2022 Microchip Technology Inc. and its subsidiaries. DS20005910B-page 7 MIC2810 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — — +260 °C Soldering, 10 sec. Junction Temperature TJ –40 — +125 °C — Package Thermal Resistance 16-Ld QFN θJA — 56 — °C/W — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. |
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