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STM32L011D4P7 Fiches technique(PDF) 97 Page - STMicroelectronics |
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STM32L011D4P7 Fiches technique(HTML) 97 Page - STMicroelectronics |
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97 / 119 page ![]() DocID027973 Rev 5 97/119 STM32L011x3/4 Package information 115 7.2 UFQFPN32 package information Figure 35. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. |
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