STM32L15XCC datasheet(102/136 Pages) STMICROELECTRONICS

No de pièce	STM32L15XCC

Description	Ultra-low-power 32-bit MCU ARM®-based Cortex®-M3, 256KB Flash, 32KB SRAM, 8KB EEPROM, LCD, USB, ADC, DAC

PDF	136 Pages

Scroll/Zoom	100%

Fabricant	STMICROELECTRONICS [STMicroelectronics]

Site Internet	http://www.st.com

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102 / 136 page

Electrical characteristics

STM32L151xC STM32L152xC

102/136

DocID022799 Rev 13

Figure 30. Maximum dynamic current consumption on VREF+ supply pin during ADC

conversion

General PCB design guidelines

Power supply decoupling should be performed as shown in Figure 12. The applicable

procedure depends on whether VREF+ is connected to VDDA or not. The 100 nF capacitors

should be ceramic (good quality). They should be placed as close as possible to the chip.

ADC clock

Sampling (n cycles)

Conversion (12 cycles)

Iref+

300µA

700µA

MS36686V1

Table 58. Maximum source impedance RAIN max(1)

(µs)

RAIN max (kΩ)

Ts (cycles)

fADC=16 MHz(2)

Multiplexed channels

Direct channels

2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V

0.25

Not allowed

0.7

Not allowed

0.5625

0.8

Not allowed

2.0

1.0

2.0

0.8

4.0

3.0

1.5

3.0

1.8

6.0

4.5

6.8

4.0

15.0

10.0

15.0

10.0

30.0

20.0

32.0

25.0

50.0

40.0

192

50.0

384

1. Guaranteed by design.

2. Number of samples calculated for fADC = 16 MHz. For fADC = 8 and 4 MHz the number of sampling cycles can be reduced

with respect to the minimum sampling time Ts (µs),

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