MIC69301 datasheet(6/26 Pages) MICROCHIP

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MIC69301/2/3

DS20006625A-page 6



2021 Microchip Technology Inc. and its subsidiaries

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Operating Junction Temperature

Range

–40

—

+125

°C

Note 1

Storage Temperature Range

–65

—

+125

°C

—

Lead Temperature

TLEAD

—

+260

°C

—

Package Thermal Resistance

Thermal Resistance, S-PAK 5-Ld

θJC

—

°C/W —

Thermal Resistance, S-PAK 5-Ld

θJA

—

°C/W —

Thermal Resistance, TO-263 5-Ld

θJC

—

°C/W —

Thermal Resistance, ePad SOIC 8-Ld

θJA

—

°C/W —

Thermal Resistance, DFN 12-Ld

θJA

—

°C/W —

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

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