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MIC39300 Fiches technique(PDF) 6 Page - Microchip Technology |
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MIC39300 Fiches technique(HTML) 6 Page - Microchip Technology |
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6 / 24 page ![]() MIC39300/01/02 DS20006017B-page 6 2018 - 2022 Microchip Technology Inc. and its subsidiaries TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Lead Temperature — — — 260 °C Soldering, 5 sec. Junction Operating Temperature Range TJ –40 — +125 °C — Storage Temperature Range TS –65 — +150 °C — Package Thermal Resistances Thermal Resistance TO-263 JC — 2 — °C/W — Thermal Resistance TO-220 JC — 2 — °C/W — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. |
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