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BAT54L Fiches technique(PDF) 14 Page - FutureWafer Tech Co.,Ltd |
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BAT54L Fiches technique(HTML) 14 Page - FutureWafer Tech Co.,Ltd |
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14 / 21 page ![]() BAT54 Family Surface Mount Schottky Barrier Diode 14 Document No.: F41806F 07-FEB-2022 V 2.2 www.futurewafer.com.tw FQE-001-04 Dimension W B1 D D1 E F K P P0 P2 t W Value 8 mm 4.5 Max. 1.5 ±0.10 0.35 min. 1.75 ±0.10 3.5 ±0.05 2.4 Max. 4.0 ±0.10 4.0 ±0.10 2.0 ±0.1 0.4 Max. 8.0 ±0.3 A0 / B0 / K0 Determined by Component Size. The Clearance Between The Component And The Cavity Must Comply to The Rotational and Lateral Movement Requirement Provided in Figures in The “Maximum Component Movement in Tape Pocket” Section. 6-1. Taping and Reel Specification-SOT23 / SOT323 6-2. Embossed Carrier Tape Specification-SOT23 / SOT323 6. Packing Unit: mm Taping Width Tape Orientation 8mm Direction Of Feed |
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