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REF70 Fiches technique(PDF) 22 Page - Texas Instruments |
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REF70 Fiches technique(HTML) 22 Page - Texas Instruments |
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22 / 40 page ![]() J A D JA T T P R T u (3) where • PD is the device power dissipation • TJ is the device junction temperature • TA is the ambient temperature • RθJA is the package (junction-to-air) thermal resistance Because of this relationship, acceptable load current in high temperature conditions may be less than the maximum current-sourcing capability of the device. In no case should the device be operated outside of its maximum power rating because doing so can result in premature failure or permanent damage to the device. REF70 SNAS781D – OCTOBER 2020 – REVISED DECEMBER 2021 www.ti.com 22 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: REF70 |
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