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BAS70LP Fiches technique(PDF) 13 Page - FutureWafer Tech Co.,Ltd |
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BAS70LP Fiches technique(HTML) 13 Page - FutureWafer Tech Co.,Ltd |
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13 / 18 page ![]() 13 Document No.: F21837G 27-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 BAS70 Series Surface Mount Switching Diode 6-3. Taping and Reel Specification-SOD123FL & SOD323 & SOD323FL Taping Width Tape Orientation 8mm 6-4. Embossed Carrier Tape Specification-SOD123FL & SOD323 & SOD323FL Dimension W D D1 E F P P0 P2 t W Values 8 mm 1.5 ±0.1 1.3 Max. 1.75 ±0.1 3.5 ±0.05 4 ±0.1 4 ±0.1 2 ±0.1 0.23 ±0.02 8 +0.3 / -0.1 A0 / B0 / K0 Determined by Component Size. The Clearance Between the Component And The Cavity Must Comply to The Rotational And Lateral Movement Requirement Provided in Figures in The “Maximum Component Movement in Tape Pocket” Section. Unit: mm Direction Of Feed |
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