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BAS40WD Fiches technique(PDF) 8 Page - FutureWafer Tech Co.,Ltd |
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BAS40WD Fiches technique(HTML) 8 Page - FutureWafer Tech Co.,Ltd |
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8 / 11 page ![]() BAS40WD Series Surface Mount Switching Diode 8 Document No.: F21837W 30-DEC-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 6-1. Taping and Reel Specification-SOD323 & SOD323FL Taping Width Tape Orientation 8mm 6-2. Embossed Carrier Tape Specification-SOD323 & SOD323FL Dimension W D D1 E F P P0 P2 t W Values 8 mm 1.5 ±0.1 1.3 Max. 1.75 ±0.1 3.5 ±0.05 4 ±0.1 4 ±0.1 2 ±0.1 0.23 ±0.02 8 +0.3 / -0.1 A0 / B0 / K0 Determined by Component Size. The Clearance Between the Component And The Cavity Must Comply to The Rotational And Lateral Movement Requirement Provided in Figures in The “Maximum Component Movement in Tape Pocket” Section. Unit: mm Direction Of Feed 6. Packing |
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