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ADCMP581 Fiches technique(PDF) 14 Page - Analog Devices |
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ADCMP581 Fiches technique(HTML) 14 Page - Analog Devices |
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14 / 16 page ![]() Preliminary Technical Data ADCMP580/ADCMP581/ADCMP582 Rev. PrA | Page 14 of 16 OUTLINE DIMENSIONS 1 0.50 BSC 0.60 MAX PIN 1 INDICATOR 1.50 REF 0.50 0.40 0.30 0.25 MIN 0.45 2.75 BSC SQ TOP VIEW 12° MAX 0.80 MAX 0.65 TYP SEATING PLANE PIN 1 INDICATOR 1.00 0.85 0.80 0.30 0.23 0.18 0.05 MAX 0.02 NOM 0.20 REF 3.00 BSC SQ 1.65 1.50 SQ* 1.35 BOTTOM VIEW 16 5 13 8 9 12 4 * COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2 EXCEPT FOR EXPOSED PAD DIMENSION Figure 27. 16-Lead Lead Frame Chip Scale Package [LFCSP] (CP-16) Dimensions shown in millimeters ORDERING GUIDE Model Temperature Range Package Description Package Option ADCMP580BCP −40°C to +85°C LFCSP-16 CP-16 ADCMP581BCP −40°C to +85°C LFCSP-16 CP-16 ADCMP582BCP −40°C to +85°C LFCSP-16 CP-16 |
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