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ADP5303ACBZ-3-R7 Fiches technique(PDF) 21 Page - Analog Devices |
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ADP5303ACBZ-3-R7 Fiches technique(HTML) 21 Page - Analog Devices |
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21 / 21 page ![]() Data Sheet ADP5303 Rev. B | Page 21 of 21 OUTLINE DIMENSIONS A B C 0.660 0.600 0.540 1.690 1.650 1.610 1.910 1.870 1.830 1 2 3 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) END VIEW 0.360 0.320 0.280 1.00 REF 0.50 BSC SEATING PLANE 0.270 0.240 0.210 0.345 0.325 0.305 0.455 0.435 0.415 0.390 0.360 0.330 COPLANARITY 0.04 BALL A1 IDENTIFIER Figure 44. 9-Ball Wafer Level Chip Scale Package [WLCSP] 1.65 mm × 1.87 mm Body (CB-9-6) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option ADP5303ACBZ-1-R7 −40°C to +125°C 9-Ball Wafer Level Chip Scale Package [WLCSP] CB-9-6 ADP5303ACBZ-2-R7 −40°C to +125°C 9-Ball Wafer Level Chip Scale Package [WLCSP] CB-9-6 ADP5303ACBZ-3-R7 −40°C to +125°C 9-Ball Wafer Level Chip Scale Package [WLCSP] CB-9-6 ADP5303-EVALZ Evaluation Board 1 Z = RoHS Compliant Part. ©2015–2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D13444-0-3/19(B) |
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