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MIC4451YN Fiches technique(PDF) 5 Page - Microchip Technology |
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MIC4451YN Fiches technique(HTML) 5 Page - Microchip Technology |
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5 / 24 page ![]() 2021 Microchip Technology Inc. and its subsidiaries DS20006616A-page 5 MIC4451/52 Test Circuits FIGURE 1-1: Inverting Driver Switching Time. FIGURE 1-2: Non-Inverting Driver Switching Time. FIGURE 1-3: Peak Output Current Test Circuit. TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Ambient Operating Temperature Range TA 0 — +70 °C Z Ordering Option –40 — +85 °C Y Ordering Option –40 — +125 °C V Ordering Option Storage Temperature Range TS –65 — +150 °C — Chip Operating Temperature — — — +150 °C — Lead Temperature — — — +300 °C Soldering, 10 sec. Package Thermal Resistance Thermal Resistance, TO-220 5-Ld θJC — 10 — °C/W — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. |
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