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MMPF0200Z Fiches technique(PDF) 113 Page - NXP Semiconductors |
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MMPF0200Z Fiches technique(HTML) 113 Page - NXP Semiconductors |
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113 / 118 page ![]() Analog Integrated Circuit Device Data Freescale Semiconductor 113 PF0200Z Packaging Packaging Dimensions 8 Packaging 8.1 Packaging Dimensions Package dimensions are provided in package drawings. To find the most current package outline drawing, go to www.freescale.com and perform a keyword search for the drawing’s document number. See the Thermal Characteristics section for specific thermal characteristics for each package. Table 124. Package Drawing Information Package Suffix Package Outline Drawing Number 56 QFN 8x8 mm - 0.5 mm pitch. WF-Type (wettable flank) ES 98ASA00589D |
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