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MSCSM170AM039CT6AG Fiches technique(PDF) 12 Page - Microchip Technology |
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MSCSM170AM039CT6AG Fiches technique(HTML) 12 Page - Microchip Technology |
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12 / 17 page ![]() 2. Package Specifications The following section shows the package specification of the MSCSM170AM039CT6AG device. 2.1 Package Outline The following figure shows the package outline drawing of the MSCSM170AM039CT6AG device. The dimensions in the following figure are in millimeters. Figure 2-1. Package Outline Drawing Note: See application note APT0601—Mounting Instructions for SP6 Power Modules for more information. MSCSM170AM039CT6AG Package Specifications © 2021 Microchip Technology Inc. Datasheet DS00003969A-page 12 |
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