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MSCSM170HM45CT3AG Fiches technique(PDF) 12 Page - Microchip Technology |
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MSCSM170HM45CT3AG Fiches technique(HTML) 12 Page - Microchip Technology |
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12 / 17 page ![]() 2. Package Specifications The following section shows the package specification of the MSCSM170HM45CT3AG device. 2.1 Package Outline The following figure shows the package outline drawing of the MSCSM170HM45CT3AG device. The dimensions in the following figure are in millimeters. Figure 2-1. Package Outline Drawing Note: See AN3500A—Mounting Instructions for SP1F and SP3F Power Modules for more information. MSCSM170HM45CT3AG Package Specifications © 2021 Microchip Technology Inc. Datasheet DS00003954A-page 12 |
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