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USB5916CT/KD Fiches technique(PDF) 50 Page - Microchip Technology |
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USB5916CT/KD Fiches technique(HTML) 50 Page - Microchip Technology |
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50 / 66 page ![]() USB5916 DS00002243E-page 50 2016-2021 Microchip Technology Inc. 10.3 Package Thermal Specifications FIGURE 10-1: SUPPLY RISE TIME MODEL Note: The rise time for the 3.3 V supply can be extended to 100ms max if RESET_N is actively driven low, typi- cally by another IC, until 1 µs after all supplies are within operating range. TABLE 10-1: PACKAGE THERMAL PARAMETERS Symbol °C/W Velocity (Meters/s) JA 19 0 16 1 JT 0.1 0 0.1 1 JC 1.4 0 1.4 1 Note: Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESDN51. TABLE 10-2: MAXIMUM POWER DISSIPATION Parameter Value Units PD(max) 1.94 W t10% 10% 90% Voltage TRT t90% Time 100% 3.3 V VSS VDD33 90% 100% 1.2 V VDD12 |
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