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ICS557-08 Fiches technique(PDF) 9 Page - Integrated Circuit Systems |
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ICS557-08 Fiches technique(HTML) 9 Page - Integrated Circuit Systems |
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9 / 11 page ![]() MDS 557-08 C 9 Revision 021606 In te gr ated Circuit Systems ● 525 Ra ce Street, San Jose, CA 9512 6 ● tel (4 08) 297-1 201 ● www.icst.com ICS557-08 2:1 Multiplexer Chip for PCI-Express Thermal Characteristics Marking Diagram (ICS557G-08) Marking Diagram (ICS557G-08LF) Marking Diagram (ICS557GI-08) Marking Diagram (ICS557GI-08LF) Notes: 1. ###### is the lot code. 2. YYWW is the last two digits of the year, and the week number that the part was assembled. 3. “LF” denotes Pb free package. 4. “I” denotes industrial temperature device 5. Bottom marking: (origin). Origin = country of origin if not USA. Parameter Symbol Conditions Min. Typ. Max. Units Thermal Resistance Junction to Ambient θ JA Still air 93 °C/W θ JA 1 m/s air flow 78 °C/W θ JA 3 m/s air flow 65 °C/W Thermal Resistance Junction to Case θ JC 20 °C/W 1 8 9 16 557G-08 ###### YYWW$$ 1 8 9 16 557G08LF ###### YYWW 1 8 9 16 557GI-08 ###### YYWW$$ 1 8 9 16 557GI08L ###### YYWW |
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