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LTYB Fiches technique(PDF) 5 Page - Linear Technology |
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LTYB Fiches technique(HTML) 5 Page - Linear Technology |
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5 / 12 page ![]() LTC1983-3/LTC1983-5 5 sn1983 1983fs PI FU CTIO S VIN (Pin 1): Charge Pump Input Voltage. May be between 2.3V and 5.5V. VIN should be bypassed with a ≥4.7µF low ESR capacitor as close as possible to the pin for best performance. VOUT (Pin 2): Regulated Output Voltage for the IC. VOUT should be bypassed with a ≥4.7µF low ESR capacitor as close as possible to the pin for best performance. C+ (Pin 3): Charge Pump Flying Capacitor Positive Termi- nal. This node is switched between VIN and GND (It is connected to VCC during shutdown). C– (Pin 4): Charge Pump Flying Capacitor Negative Termi- nal. This node is switched between GND and VOUT (It is connected to GND during shutdown). GND (Pin 5): Signal and Power Ground for the 6-Pin SOT-23 package. This pin should be tied to a ground plane for best performance. SHDN (Pin 6): Shutdown. Grounding this pin shuts down the IC. Tie to VIN to enable. This pin should not be pulled above the VIN voltage or below GND. BLOCK DIAGRA CONTROL LOGIC CLOCK2 CLOCK1 S1A S2A S1B S2B VREF CHARGE PUMP SHDN VIN CIN 10 µF CFLY 1 µF COUT 10 µF LTC1983-X C+ C– VOUT COMP1 1 µA 1983 BD |
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