HMC773ALC3BTR-R5 datasheet(4/22 Pages) AD

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HMC773ALC3B

Data Sheet

Rev. F | Page 4 of 22

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

RF Input Power

21 dBm

LO Input Power

21 dBm

IF Input Power

21 dBm

IF Source and Sink Current

2 mA

Channel Temperature

175°C

Continuous PDISS (T = 85°C) (Derate 4.44 mw/°C

Above 85°C)

400 mW

Maximum Peak Reflow Temperature (MSL3)1

260°C

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

2000 V (Class 2)

Field Induced Charged Device Model

(FICDM)

1200 V (Class C5)

1 See the Ordering Guide section.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure.

θJC is the junction to case thermal resistance.

Table 4. Thermal Resistance

Package Type

θJA

θJC

Unit

E-12-41

120

225

°C/W

1 See JEDEC standard JESD51-2 for additional information on optimizing the

thermal impedance (PCB with 3 × 3 vias).

ESD CAUTION

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