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MIC861 Fiches technique(PDF) 5 Page - Microchip Technology |
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MIC861 Fiches technique(HTML) 5 Page - Microchip Technology |
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5 / 24 page ![]() TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Storage Temperature TS — — 150 °C — Ambient Temperature Range TA –40 — +85 °C — Lead Temperature — — — 260 °C Soldering, 5s Package Thermal Resistance Thermal Resistance SC70 JA — 450 — °C/W — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +85°C rating. Sustained junction temperatures above +85°C can impact the device reliability. 2020 Microchip Technology Inc. DS20006347A-page 5 MIC861 |
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