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TSU112IYQ3T Fiches technique(PDF) 26 Page - STMicroelectronics |
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TSU112IYQ3T Fiches technique(HTML) 26 Page - STMicroelectronics |
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26 / 32 page ![]() Table 7. MiniSO8 package mechanical data Dim. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 1.10 1.10 A1 0 0.15 0.05 0.15 A2 0.75 0.85 0.95 0.75 0.85 0.95 A3 0.30 0.35 0.40 0.30 0.35 0.40 b 0.22 0.40 0.28 0.36 c 0.08 0.23 0.15 0.19 D 2.80 3.00 3.20 2.90 3.00 3.10 E 4.65 4.90 5.15 4.70 4.90 5.10 E1 2.80 3.00 3.10 2.90 3.00 3.10 e 0.65 0.65 L 0.40 0.60 0.80 0.40 0.70 L1 0.95 0.95 k 0 8 0 8 ccc 0.10 0.10 Note: TSSOP stands for thin shrink small outline package. Dimensions "D" and "E1" do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. Figure 46. MiniSO8 recommended footprint TSU112IY MiniSO8 package information DS13616 - Rev 1 page 26/32 |
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