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LD57100 Fiches technique(PDF) 13 Page - STMicroelectronics |
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LD57100 Fiches technique(HTML) 13 Page - STMicroelectronics |
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13 / 21 page ![]() 8 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 8.1 Flip Chip6 (0.8x1.2 mm) package information Figure 27. Flip Chip6 (0.8x1.2 mm) package outline LD57100 Package information DS13123 - Rev 5 page 13/21 |
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