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ADPA7009CHIP Fiches technique(PDF) 28 Page - Analog Devices

No de pièce ADPA7009CHIP
Description  20 GHz to 54 GHz, GaAs, pHEMT, MMIC, 29 dBm (0.5 W) Power Amplifier
PDF  28 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

ADPA7009CHIP Fiches technique(HTML) 28 Page - Analog Devices

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ADPA7009CHIP
Data Sheet
Rev. 0 | Page 28 of 28
OUTLINE DIMENSIONS
2.750
1.845
*This die utilizes fragile air bridges. Any pickup tools used must not contact this area.
TOP VIEW
(CIRCUIT SIDE)
SIDE VIEW
0.572
0.108
0.114
0.389
0.389
0.460
0.112
0.354
0.255
0.179
0.220
0.179
0.255
0.175
0.130
0.898
0.102
0.644
0.786
0.197
0.197
0.653
0.890
0.100 × 0.100
(Pads 2, 3, 5, 7, 9, 10)
0.240
0.130
0.119
0.118
0.093
0.012
0.898
0.100 × 0.200
(Pads 1 and 6)
0.150 × 0.100
(Pads 4 and 8)
*AIR BRIDGE
AREA
0.104
(Pads 2 - 5)
0.105
(Pads 7 - 10)
0.102
Figure 82. 10-Pad Bare Die [CHIP]
(C-10-13)
Dimensions shown in millimeter
ORDERING GUIDE
Model1, 2
Temperature Range
Package Description
Package Option
ADPA7009CHIP
−55°C to +85°C
10-Pad Bare Die [CHIP]
C-10-13
ADPA7009C-KIT
−55°C to +85°C
10-Pad Bare Die [CHIP]
C-10-13
1 The ADPA7009CHIP and ADPA7009C-KIT are RoHS compliant parts.
2 Die inspected to meet MIL-STD-883 Method 2010, Condition B.
©2021 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D26020-3/21(0)



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