MX57 datasheet(5/28 Pages) MICROCHIP

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DS20005972A-page 5

MX55/57

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Operating Temperature Range

–40

—

°C

Ordering Option I

Junction Operating Temperature

——

125

°C

—

Storage Temperature Range

–65

—

150

°C

—

Soldering Temperature

—

260

°C

10 sec. max.

Package Thermal Resistance

Thermal Resistance from Junction to

Ambient

JA

—53

°C/W

5 mm x 7 mm

—

5 mm x 3.2 mm

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

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