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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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STM32F091CCY6TP Fiches technique(PDF) 100 Page - STMicroelectronics |
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STM32F091CCY6TP Fiches technique(HTML) 100 Page - STMicroelectronics |
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100 / 128 page  Package information STM32F091xB STM32F091xC 100/128 DocID026284 Rev 4 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 7.1 UFBGA100 package information UFBGA100 is a 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra-fine-profile ball grid array package. Figure 33. UFBGA100 package outline 1. Drawing is not to scale. Table 70. UFBGA100 package mechanical data Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A - - 0.600 - - 0.0236 A1 - - 0.110 - - 0.0043 A2 - 0.450 - - 0.0177 - A3 - 0.130 - - 0.0051 0.0094 A4 - 0.320 - - 0.0126 - |
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