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M24128X-FCU6/TF Fiches technique(PDF) 25 Page - STMicroelectronics

No de pièce M24128X-FCU6/TF
Description  128-Kbit serial I²C bus EEPROM with configurable device address and software write protection, delivered in 4-ball CSP
PDF  35 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M24128X-FCU6/TF Fiches technique(HTML) 25 Page - STMicroelectronics

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Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
10.1
Ultra thin WLCSP4 package information
Figure 15. Ultra thin WLCSP- 4-bump, 0.851 x 0.851 mm, wafer level chip scale package outline
Wafer back side
Side view
Orientation
reference
(4X)
aaa
E
D
X
Y
Detail A
bbb Z
A2
A
Bump
A1
Z
Detail A
Rotated 90 °
eee Z
b (4X)
e1
G
G
F
e
Seating plane
Orientation
reference
X Y
Ø
ddd M
Z
Ø
ccc M
Z
F
1.
Drawing is not to scale.
2.
Primary datum Z and seating plane are defined by the spherical crowns of the bump.
M24128X-FCU
Package information
DS12680 - Rev 2
page 25/35



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