BLUENRG-M2SP datasheet(14/30 Pages) STMICROELECTRONICS

No de pièce	BLUENRG-M2SP

Description	Very low power application processor module for Bluetooth® low energy v5.0

PDF	30 Pages

Scroll/Zoom	100%

Fabricant	STMICROELECTRONICS [STMicroelectronics]

Site Internet	http://www.st.com

Logo

14 / 30 page

6.3

Reflow soldering

The BlueNRG-M2 is a high temperature strength surface mount Bluetooth® module supplied on a 23-pin

(BLUENRG-M2SA) or 20 pin (BLUENRG-M2SP), 4-layer PCB. The final assembly recommended reflow profiles

are indicated here below.

Soldering phase has to be executed with care: in order to avoid undesired melting phenomenon, particular

attention has to be taken on the set up of the peak temperature.

Here are some suggestions for the temperature profile based on the following recommendations.

Table 10. Soldering profile

Profile feature

PB-free assembly

Average ramp up rate (TSMAX to Tp)

3°C/ s max.

Preheat

temperature min (TS min.)

temperature max (TS max.)

time (tS min to tS max.) (tS)

150 °C

200 °C

60-100 s

Time maintained above:

Temperature TL

Time tL

217 °C

60-70 s

Peak temperature (TP)

245 (-0) °C

Time within 5 °C of peak temperature (TP -5°)

min. 30 s

Ramp down rate

6 °C/s

Time from 25 °C to peak temperature

8 minutes max.

Figure 7. Soldering profiles

BlueNRG-M2

Reflow soldering

DS13053 - Rev 2

page 14/30

BLUENRG-M2SP Fiches technique(PDF) 14 Page - STMicroelectronics