TL072CD datasheet(13/80 Pages) TI

13 / 80 page

6.11 Thermal Information: TL072x (cont.)

THERMAL METRIC(1)

TL072x

UNIT

PW (TSSOP)

U (CFP)

FK (LCCC)

8 PINS

10 PINS

20 PINS

RθJA

Junction-to-ambient thermal resistance

150

169.8

—

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

—

62.1

5.61

°C/W

RθJB

Junction-to-board thermal resistance

—

176.2

—

°C/W

ψJT

Junction-to-top characterization parameter

—

48.4

—

°C/W

ψJB

Junction-to-board characterization parameter

—

144.1

—

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

5.4

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.12 Thermal Information for Quad Channel: TL074H

THERMAL METRIC (1)

TL074H

UNIT

(SOIC)

(TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

114.2

134.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

70.3

62.6

°C/W

RθJB

Junction-to-board thermal resistance

70.2

77.6

°C/W

ψJT

Junction-to-top characterization parameter

28.8

13.0

°C/W

ψJB

Junction-to-board characterization parameter

69.8

77.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.13 Thermal Information: TL074x

THERMAL METRIC(1)

TL074x

UNIT

D (SOIC)

N (PDIP)

NS (SO)

14 PINS

RθJA

Junction-to-ambient thermal resistance

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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TL071, TL071H, TL071A, TL071B

TL072, TL072H, TL072A, TL072B, TL074, TL074H, TL074A, TL074B, TL072M, TL074M

SLOS080P – SEPTEMBER 1978 – REVISED NOVEMBER 2020

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