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M66-R2.0 Fiches technique(PDF) 1 Page - Quectel Wireless Solutions Co., Ltd. |
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M66-R2.0 Fiches technique(HTML) 1 Page - Quectel Wireless Solutions Co., Ltd. |
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1 / 2 page ![]() Quectel M66 R2.0 Ultra-compact Quad-band GSM/GPRS Module Build a Smarter World M66 R2.0 is an ultra-compact quad-band GSM/GRPS module using LCC castellation packaging. Based on the latest 2G chipset, it has the optimal performance in SMS & data transmission and audio service even in harsh environment. The highly compact 17.7mm × 15.8mm × 2.3mm profile makes it a perfect selection for size sensitive applications. M66 R2.0 adopts surface mounted technology, making it an ideal solution for durable and rugged designs. The low profile and small size of LCC package ensure it can be easily embedded into size-constrained applications, and provides reliable connectivity with applications. This kind of package is ideally suited for large-scale manufacturing which has strict requirements for cost and efficiency. The compact form factor, low power consumption and extended temperature range make M66 R2.0 a best choice for M2M applications such as wearable devices, automotive, industrial PDA, personal tracking, wireless POS, smart metering, telematics, and so on. Key Benefits Extremely compact quad-band GSM/GPRS module Easier soldering process with LCC package Power consumption as low as 1.3mA Support Voice and QuecFOTA® functions Embedded powerful Internet service protocols, multiple Sockets & IP addresses Quad-band GPRS Multi-slot Class 12 Highly Compact Size LCC Package Embedded Internet Services Protocols Quectel Enhanced AT Commands Digital Audio EMAIL US: info@quectel.com VISIT US: www.quectel.com Extended Temperature Range: -40°C ~ +85°C Bluetooth 3.0 Rev: V1.1 | Status: Released |
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