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STM32F722IC Fiches technique(PDF) 202 Page - STMicroelectronics |
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STM32F722IC Fiches technique(HTML) 202 Page - STMicroelectronics |
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202 / 229 page ![]() Package information STM32F722xx STM32F723xx 202/229 DS11853 Rev 6 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 7.1 LQFP64 – 10 x 10 mm, low-profile quad flat package information LQFP64 is a 64-pin, 10 x 10 mm low-profile quad flat package. Figure 80. LQFP64 outline 1. Drawing is not to scale. 5W_ME_V3 SEATING PLANE ccc C b C L L1 K IDENTIFICATION PIN 1 D D1 D3 e 1 16 17 32 33 48 49 64 GAUGE PLANE 0.25 mm Table 115. LQFP64 mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A - - 1.60 - - 0.0630 A1 0.05 - 0.15 0.0020 - 0.0059 A2 1.350 1.40 1.45 0.0531 0.0551 0.0571 |
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