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AMC3301 Fiches technique(PDF) 35 Page - Texas Instruments |
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AMC3301 Fiches technique(HTML) 35 Page - Texas Instruments |
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35 / 37 page ![]() www.ti.com EXAMPLE BOARD LAYOUT (9.75) 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND (9.3) 14X (1.27) 16X (1.65) 16X (0.6) 14X (1.27) 16X (2) 16X (0.6) 4223098/A 07/2016 SOIC - 2.65 mm max height DWE0016A SOIC SYMM SYMM SEE DETAILS 1 8 9 16 SYMM HV / ISOLATION OPTION 8.1 mm CLEARANCE/CREEPAGE NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS OPENING SOLDER MASK METAL SOLDER MASK DEFINED LAND PATTERN EXAMPLE SCALE:4X SYMM 1 8 9 16 IPC-7351 NOMINAL 7.3 mm CLEARANCE/CREEPAGE SEE DETAILS |
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