LIS2DW12 datasheet(57/66 Pages) STMICROELECTRONICS

No de pièce	LIS2DW12

Description	MEMS digital output motion sensor: high-performance ultra-low-power 3-axis

PDF	66 Pages

Scroll/Zoom	100%

Fabricant	STMICROELECTRONICS [STMicroelectronics]

Site Internet	http://www.st.com

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57 / 66 page

Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,

depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product

status are available at: www.st.com. ECOPACK is an ST trademark.

9.1

Soldering information

The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard.

It is qualified for soldering heat resistance according to JEDEC J-STD-020.

Land pattern and soldering recommendations are available at www.st.com.

9.2

LGA-12 package information

Figure 18. LGA-12 2.0 x 2.0 x 0.7 mm package outline and mechanical data

Dimensions are in millimeter unless otherwise specified

General Tolerance is +/-0.15mm unless otherwise specified

OUTER DIMENSIONS

ITEM

DIMENSION [mm]

TOLERANCE [mm]

Length [L]

±0.1

Width [W]

±0.1

Height [H]

0.7 MAX

DM00170568_2

LIS2DW12

Package information

DS11811 - Rev 8

page 57/66

LIS2DW12 Fiches technique(PDF) 57 Page - STMicroelectronics