LP1130 datasheet(3/5 Pages) POWER

3 / 5 page

LP1130-01

Apr.-2018

Email: marketing@lowpowersemi.com

www.lowpowersemi.com

Page 3 of 5

Preliminary Datasheet

LP1130

Function Diagram

OTP

UVLO

LOGIC

Anti-Cross

Conduction

VCC

PWM

BST

SWN

PGND

VCC

VIN

Absolute Maximum Ratings



VCC ----------------------------------------------------------------------------------------------------------------- -0.3V to 15V



VIN ------------------------------------------------------------------------------------------------------------------- -0.3V to 30V



BST

--------------------------------------------------------------------------------------------------------------- -0.3V to 35V



BST to SWN ------------------------------------------------------------------------------------------------------ -0.3V to 15V



SWN ------------------------------------------------------------------------------------------------------------------- -5V to 20V



EN,PWM ---------------------------------------------------------------------------------------------------------- -0.3V to 6.5V



Maximum Junction Temperature ------------------------------------------------------------------------------------ 160℃



Maximum Soldering Temperature (at leads,10 sec) ----------------------------------------------------------- 260℃



Storage Temperature --------------------------------------------------------------------------------------- -55℃ to 165℃



Operating Ambient Temperature Range -------------------------------------------------------------- -40℃ to 85℃

Note1：All voltages are with respect to PGND except where noted.

Note2：Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications

is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Note3: This device is ESD sensitive. Use standard ESD precautions when handling.

Thermal Information

Package Thermal Resistance (Note4)



Maximum Power Dissipation (PD,TA=25℃) ------------------------------------------------------------------------ 1.5W



Junction to Ambient, θJA----------------------------------------------------------------------------------------------- 80℃/W

Note4：2 layer board, 1 in2 Cu, 1 oz thickness.

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