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LPW5213 Fiches technique(PDF) 2 Page - Lowpower Semiconductor inc

No de pièce LPW5213
Description  3A Smart Power Switch
PDF  5 Pages
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Fabricant  POWER [Lowpower Semiconductor inc]
Site Internet  http://www.lowpowersemi.com
Logo POWER - Lowpower Semiconductor inc

LPW5213 Fiches technique(HTML) 2 Page - Lowpower Semiconductor inc

  LPW5213 Datasheet HTML 1Page - Lowpower Semiconductor inc LPW5213 Datasheet HTML 2Page - Lowpower Semiconductor inc LPW5213 Datasheet HTML 3Page - Lowpower Semiconductor inc LPW5213 Datasheet HTML 4Page - Lowpower Semiconductor inc LPW5213 Datasheet HTML 5Page - Lowpower Semiconductor inc  
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LPW5213-00
May.-2018
Email: marketing@lowpowersemi.com
www.lowpowersemi.com
Page 2 of 5
Preliminary Datasheet
LPW5213
Functional Pin Description
Package Type
Pin Configurations
SOT23-6
1
2
3
6
4
OUT
NC
EN
GND
VIN
SOT23-6
TOP VIEW
5
GND
Pin Description
Pin
Name
Description
1
EN
Device Enable (active High).
2/5
GND
Ground.
3
VIN
Input pin.
4
OUT
Output pin.
6
NC
No Connector.
Absolute Maximum Ratings
Note 1
Input Voltage to GND --------------------------------------------------------------------------------------------------- 6.5V
Output Voltage to GND ------------------------------------------------------------------------------------------------ 6.5V
Other pin to GND ---------------------------------------------------------------------------------------------------------- 6V
Maximum Junction Temperature --------------------------------------------------------------------------------- 150°C
Operating Ambient Temperature Range (TA) -------------------------------------------------------- -40℃ to 85°C
Maximum Soldering Temperature (at leads, 10 sec) ------------------------------------------------------- 260°C
Note 1.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational
sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Thermal Information
Maximum Power Dissipation (PD) ---------------------------------------------------------------------------------- 0.5W
Thermal Resistance (θJA) ---------------------------------------------------------------------------------------- 250℃/W
ESD Susceptibility
HBM(Human Body Mode) --------------------------------------------------------------------------------------------- 2KV
MM(Machine Mode) --------------------------------------------------------------------------------------------------- 200V



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