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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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DRV8428PDYYR Fiches technique(PDF) 30 Page - Texas Instruments |
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DRV8428PDYYR Fiches technique(HTML) 30 Page - Texas Instruments |
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30 / 46 page  www.ti.com PACKAGE OUTLINE C 16X 0.30 0.18 1.66 0.1 16X 0.5 0.3 0.8 0.7 (0.1) TYP 0.05 0.00 12X 0.5 4X 1.5 A 3.15 2.85 B 3.15 2.85 WQFN - 0.8 mm max height RTE0016J PLASTIC QUAD FLATPACK - NO LEAD 4224278/A 05/2018 PIN 1 INDEX AREA 0.08 SEATING PLANE 1 4 9 12 5 8 16 13 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD 17 SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 3.600 30 DRV8428E, DRV8428P SLOSE51 – JUNE 2020 www.ti.com Product Folder Links: DRV8428E DRV8428P Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated |
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