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TLN210 Fiches technique(PDF) 2 Page - Toshiba Semiconductor |
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TLN210 Fiches technique(HTML) 2 Page - Toshiba Semiconductor |
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2 / 4 page ![]() TLN210(F) 2004-01-06 2 Precautions Please be careful of the followings. 1. Soldering temperature: 260°C max Soldering time: 5s max (Soldering must be performed 2mm from the bottom of the package.) 2. When forming the leads, bend each lead under the 2mm from the body of the device. Soldering must be performed after the leads have been formed. 3. The TLN210(F) for a still camera AF use only. Please do not use this device except for a still camera. |
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