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MPX4100AS Fiches technique(PDF) 7 Page - NXP Semiconductors

No de pièce MPX4100AS
Description   Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated
PDF  13 Pages
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Fabricant  NXP [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo NXP - NXP Semiconductors

MPX4100AS Fiches technique(HTML) 7 Page - NXP Semiconductors

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MPX4100A
Sensors
Freescale Semiconductor
7
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
The two sides of the pressure sensor are designated as
the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel,
which protects the die from harsh media. The MPX pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table:
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
Figure 5. SOP Footprint (Case 482)
Part Number
Case Type
Pressure (P1) Side Identifier
MPX4100A
867
Stainless Steel Cap
MPX4100AP
867B
Side with Part Marking
MPX4100AS
867E
Side with Port Attached
MPXAZ4100A6U, MPXA4100A6U/TI
482
Side with Part Marking
MPXAZ4100AC6U, MPXA4100AC6U
482A
Side with Port Attached
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm
SCALE 2:1



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