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AT21CS01 Fiches technique(PDF) 38 Page - Microchip Technology

No de pièce AT21CS01
Description  Single-Wire, I/O Powered 1-Kbit (128 x 8) Serial EEPROM with a Unique, Factory-Programmed 64-Bit Serial Number
PDF  47 Pages
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Fabricant  MICROCHIP [Microchip Technology]
Site Internet  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

AT21CS01 Fiches technique(HTML) 38 Page - Microchip Technology

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DRAWING NO.
REV.
TITLE
GPC
2MS-1
B
10/14/14
2MS-1, 2-pad 5.0x3.5 mm Body, 0.40 thick,
Extra Thin Single Flat No Lead Package (XSFN)
YDR
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
TYP
MAX
NOTE
A
0.30
0.35
0.40
A1
0.00
0.035
0.05
A3
0.127 REF
b
1.05
1.10
1.15
3
L
4.55
4.60
4.65
D
5.00 BSC
E
3.50 BSC
e
2.00 BSC
0
0°
-
-
2
K
0.90 REF
Notes:
1. Dimensioning and tolerancing conform to ASME Y14.5M - 1994.
2. All dimensions are in millimeters, 0 is in degrees.
3. Dimension ‘b’ applies to metallized terminal and is measured between 0.15
and 0.30mm from terminal tip. If the terminal has the optional radius on the
other end of the terminal, the dimension ‘b’ should not be measured in that
radius area.
4. Maximum package warpage is 0.05mm.
5. Maximum allowable burrs is 0.076mm in all directions.
6. Pin #1 on top will be laser marked.
7. Unilateral coplanarity zone applies to the exposed heat sink slug as well as
the terminals.
0.10 m C A B
v
0.05
C
3
6
TOP VIEW
BOTTOM VIEW
(DATUM A)
B
A
k 0.10 C
4X
Pin1 Corner
(DATUM B)
1
2
A1
SEATING PLANE
A3
C
SIDE VIEW
1
2
D
E
A
7
0
C0.60 X 45°
e
b
L
0.200
0.200
K
7
Pin1 Corner
m
k 0.050 C
h 0.10 C
Note:  For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging.
AT21CS01/AT21CS11
© 2017 Microchip Technology Inc.
Datasheet
DS20005857A-page 38



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