Features

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Global shutter technology, ST proprietary single layer

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3D stacked sensor 40 nm/65 nm

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2.61 µm x 2.61 µm BSI pixel with full DTI (deep trench isolation)

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High-performance with excellent

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QE (quantum efficiency)

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MTF (modulation transfer function) up to near IR

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Perfect PLS (shutter efficiency)

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Smallest sensor on market with 1.5 Mpixel resolution

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Compact die size: 3.6 mm x 4.3 mm

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1124 pixels x 1364 pixels

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Very small pixel array, 2.9 mm x 3.6 mm

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Optical format ¼ inch

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Operating junction temperature: -30 °C to 85 °C

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Dual lane transmitter MIPI CSI-2 (copyright© 2005-2010 MIPI Alliance, Inc.

Standard for Camera Serial Interface 2 (CSI-2) version 1.0) version 1.3, 1.5

Gbps per lane

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Fast mode+ I2C control interface

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Integrated temperature sensor

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Up to 100 fps (frames per second) at full resolution and 260 fps with VGA

resolution

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Programmable sequences of 4-frame contexts, including frame parameters

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Automatic dark calibration

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Dynamic and map-based defective correction

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Embedded auto-exposure with 336 zone statistics

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8 multiple function IO, dynamically programmable with frame contexts (GPIO,

strobe pulse, pulse-width modulation, V sync)

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Up to 8 illumination control outputs synchronized with sensor integration periods

and master/slave external frame start

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Mirror/flip readout

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Fully sequenceable with frame contexts

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Crop

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Binning (x2 and x4)

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Sub sampling (x2 and x4)

Description

The VD56G3 is a global shutter image sensor optimized for near infrared scenes.

The sensor captures up to 100 frames per second in a 1124 x 1364 resolution format.

The pixel construction of this device minimises crosstalk.

Order code

Description

VD56G3

Bare die

Application

Engineered for high-performance

computer vision applications, including

AR/VR, personal and industrial robotics,

drones, barcodes, biometrics and

gestures, embedded vision or scene

recognition.

Typical use cases where high-

performance near IR sensing is key. Also

demanding computer vision on scene with

movement requiring no shutter artifacts.

Advanced 1.5 Mpixel, backside illuminated Global Shutter, ultra compact sensor,

with high QE, high MTF, excellent PLS, and full-features

VD56G3

Data brief

DB4116 - Rev 2 - February 2020

For further information contact your local STMicroelectronics sales office.

www.st.com